Apple M3 Ultra
Apple (Hacker News, MacRumors):
M3 Ultra is built using Apple’s innovative UltraFusion packaging architecture, which links two M3 Max dies over 10,000 high-speed connections that offer low latency and high bandwidth. This allows the system to treat the combined dies as a single, unified chip for massive performance while maintaining Apple’s industry-leading power efficiency. UltraFusion brings together a total of 184 billion transistors to take the industry-leading capabilities of the new Mac Studio to new heights.
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It features up to a 32-core CPU with 24 performance cores and eight efficiency cores, delivering up to 1.5x the performance of M2 Ultra, and up to 1.8x that of M1 Ultra. It also has the largest GPU in any Apple chip, with up to 80 graphics cores that bring up to 2x faster performance than M2 Ultra, and up to 2.6x faster than M1 Ultra.
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The unified memory architecture of M3 Ultra integrates the most high-bandwidth, low-latency memory ever available in a personal computer. Starting at 96GB, it can be configured up to 512GB, or over half a terabyte.
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